Vi20 is an infrared inspection system that is designed for inspecting internal structures and defects on wafer-level , flip chip and post grind package. It provides infrared inspection solutions to detect metal layer delamination, chips and cracks. Available in strip/boat format, reel format and wafer format.

Below are the key features of Vi20:

  • Provides throughput up to 20,000 UPH
  • Ability to handle die size of 0.4 × 0.2 mm or larger

Please Contact Us for more information.