Vi Series
Description
Vi20 is an infrared inspection system that is designed for inspecting internal structures and defects on wafer-level , flip chip and post grind package. It provides infrared inspection solutions to detect metal layer delamination, chips and cracks. Available in strip/boat format, reel format and wafer format.
Below are the key features of Vi20:
- Provides throughput up to 20,000 UPH
- Ability to handle die size of 0.4 × 0.2 mm or larger
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Green Technology
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