Si10 is used for WLCSP post sawn final test application integrated with side wall and die surface automated optical inspection before they are taped and reeled or placed on jedec tray and waffle pack. This machine will filter any defective die caused by sawing as the die goes through the final test process.

Below are the key features of Si10:
• Provides throughput up to 10,000 UPH
• Handles 12” wafer or below
• Ability to handle die size of 2.0 × 2.0 mm or larger

Please Contact Us for more information.