Mi30 is our latest model in the Mi series which provides the fastest UPH count. Artificial intelligence features such as auto pick force calibration and auto alignment were integrated into the Mi30.

Below are the key features of Mi30:

  • Provides throughput up to 30,000 UPH
  • Handles 12” wafer or below
  • Ability to handle die size of 0.2×0.2 mm or larger

Please Contact Us for more information.