Malaysia

Mi EQUIPMENT (M) SDN BHD

Mi Equipment Malaysia’s history can be traced back to 2007 with the founding of DPE Integration (M) Sdn Bhd,
which ventured into the R&D of die processing equipment. In June 2012, Mi Equipment Malaysia was incorporated in Penang,
focusing on the R&D and manufacturing of advanced packaging die sorting machine while DPE slowly phased out.
Since then, Mi Equipment Malaysia has grown rapidly. We continue to lead in technology breakthroughs through the years of
rigorous technology development together with our teams of highly professional and passionate engineers
while partnering closely with our semiconductor clients.

Mi Equipment Malaysia, serves as the headquarter of Semiconductor Equipment Business Unit, is strategically
located in Bayan Lepas, within the heart of Penang semiconductor industrial area.

Our five-storey state-of-the-art building was completed in May 2019. With a total floor space of approximately 200k sq ft, it houses
Mi Equipment Malaysia’s operations and R&D center which focus on Mi series and Vi series solutions.
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Our Solutions

Mi Series

Die sorting machine for advanced packaging, such as WLP, WLCSP, FOWLP, CSP for flip chip

Our solutions are used in telecommunication industry (5G market) for smartphones, tablets and
wireless wearable devices as well as IoT industry solutions that require high functionality, mobility and
low power consumption small form factor devices. Advances in productivity performance coupled with
integrated artificial intelligence ("AI") visual inspection technique and smart factory automation technologies.

Vi Series

Vision inspection machine for wafer and package inspection both in 2D/2.5D and Infrared modes.

Our solutions are used in telecommunication industry (5G market) for smartphones, tablets and wireless wearable devices
as well as IoT industry solutions that require high functionality, mobility and low power consumption,
small form factor devices as well as electronics and consumers’ products.

Contact Us