Mi EQUIPMENT KOREA CO LTD
(주)엠아이 이큅먼트 코리아
Mi Equipment Korea was incorporated in January 2020, focusing on R&D and manufacturing of Ai series - precision die bonding solutions.
To better prep for the growth in this emerging technology market, Mi Equipment Korea has recently relocated to a new factory
in Pyeongtaek City, Gyeonggi Province. It is strategically located within close proximity with Suwon, Seoul and Incheon.
The new factory has an expanded floor space of approximately 12k sq ft, houses the engineering centers and
manufacturing facilities for laser assisted bonding machines.
The Mi Equipment Korea aims to develop and deliver precision laser bonding equipment and
technology that can lead the semiconductor market trend.
Precision bonding machine (LAB/LCB) for extra fine pitch with thin die and substrate
Our solutions are applied for servers in telecommunications industry. This solutions also used in GPU and CPU for high performance
computing application in AI and Blockchain as well as image sensors and memory.