Mi Equipment
Mi Equipment

About Us

 

 

Overview

Mi Equipment is a leading semiconductor equipment solutions provider for wafer fabrication, back-end, assembly to final test, offering advanced technology solutions for Die Sorting, Wafer Reconstruction, Test Handling, Artificial Intelligent Enabled in Vision Inspection, Precision Die Bonding, Smart Factory Automation.

 

Under the Semiconductor Equipment Business Unit, we have strong global presence with world class R&D centers and manufacturing facilities in Malaysia, China and Korea as well as sales networks covering Southeast Asia, North America and Europe.

 

We are proud to be part of Mi Technovation Berhad.

 

 

 

Our Vision & Mission

Leading & Contributing to Global Cutting-Edge Semiconductor Equipment & Process with Innovation and Excellence.

To be a beacon of progress for our clients and stakeholders within semiconductor value chain through:

  • Innovation and Problem-Solving
  • Active Listening
  • Effective Communication and Execution
  • Quality
  • Cost and Time Efficiency

To offer fair returns to our employees, suppliers & shareholders, facilitating ongoing investments and promoting sustainable growth; extending beyond mere profit.

 

 

Our Values & Philosophy

To achieve the Aspirations, we believe the only way to do it is through a Unified Team Mi,
as signified in our Philosophy “Embracing a People-Centric Culture”;
and be guided by our Values:

and

Quality Statement

“Achieving quality through innovative design and responsible pursuit of details.”

 

 

 

 

 

 

 

Leadership

The Key Management Team of Mi Equipment Group is composed of individuals with diverse backgrounds
and extensive leadership experience. The combination of multiple perspectives and seasoned leadership leads to
innovative ideas, effective decision-making, and sustainable growth.

 

 

 
 
 
 
 
 
 
 
 
 
 
 

 

 

 

 

 

 

 

Our Journey

We have matured over the years and will continue to charter our growth towards providing advanced solutions
to meet the ever-growing demands of the market to ensure our stakeholders, namely the Customers, Shareholders,
Suppliers and Employees are aligned to our corporate values.

2007 - 2009
  • R&D in Die Processing Equipment
  • R&D in Die Sorting
  • Invented Rotary Concept Die Sorting
  • Started ESCA series
2010 - 2011
  • 1st Major customer in US
  • WLCSP 5S inspection & Die Level Test
2012 - 2013
  • Expanded market to China & Taiwan
  • Established operation base in Suzhou
2014
  • Invented Mi Series High-Speed Die Sorting & Testing with integrated Laser Marking & Testing
  • Expanded sales & service team in Taiwan
2016 - 2017
  • Established office in San Diego
  • Invented Si Series (Hard Docking Test)
  • Invented Li Series (Wafer to Wafer Sorting)
  • Invented Die Sorting with IR capability
2018
  • Mi Technovation Group IPO in Malaysia
2019 - 2020
  • New HQ Home & expanded production capacity
  • Setup engineering team in Taiwan
  • Commenced engineering centre in Korea for Ai-series
  • Major Mi series expansion in Korea market
2021
  • New factory in Suzhou China
  • Ai series ZLAB introduced in market
  • Mi series EMI solution started for 5G Products
  • 1st Integrated Smart Factory System introduced
  • SEBU established
  • New factory expansion in Korea
  • Taiwan localized Vi series manufacturing
  • Mi series EMI solution started for 5G Products
  • Introduced high accuracy wafer reconstruction Mi series for FOWLP
  • Consolidate Automation and Robotic division into Mi Equipment Malaysia
2022
  • Consolidate Vi Series into Mi Equipment Malaysia
  • Mi Series model enhancement for WLCSP
  • MiND.X Deep Learning System implementation on Mi Series
  • Si Series new Test Handler for Power segments
  • Ai series LCB introduced to market
  • Commence manufacturing operations in Suzhou China
2023
  • Mi Quantum and Quantum Plus Advanced Die Sorter introduced to the Mobility & Wearables segment
  • LCB (Laser Compression Bonder) introduced to the HPC & Memory segment
  • Mi Equipment lead by ExCO Team.
  • Mi Equipment Malaysia awarded as Top 5 Semiconductor Manufacturing Solutions Providers in Malaysia 2023
  • Mi Equipment Malaysia is honoured with the Platinum Award Winner of IET Malaysia Industry Excellence Platinum Award 2023
2024
  • SiC KGD Test Handler introduced to the Automotive & Renewable Energy segment
  • Hot Temperature Sensor Test Handler introduced to the market
  • OLED Die Sorting platform introduced to the market
  • 3D vision inspection made available with our platform
  • Mi Equipment Malaysia is awarded with Outstanding Supplier Award by SJ Semi

 

 

 

 

 

 

 

 

 

 

 

 

 

Our Awards and Recognitions

Top Semiconductor Manufacturing Solutions Provider by Semiconductor Review, 2024

Click here to read the article

Industry Excellence Platinum Award, 2023

Outstanding supplier by SJ Semiconductor (Jiangyin) Corp, 2023

Top Semiconductor Manufacturing Solutions Provider by Semiconductor Review, 2023

Click here to read the article

Penang Green Office Certification by PGC, 2022 - 2024

Sustainable Water Management Certification by PBA (Perbadanan Bekalan Air Pulau Pinang Sdn Bhd), 2022 - 2024

Certificate of Recognition (Supplier Award) by TF AMD, 2021

Best Supplier of Equipment by ASE Group, 2020

Outstanding Supplier by ASE Group, 2017 – 2019

Supplier Partnership Award by Unisem, 2017

Family Award (Outstanding Support) by ASECL, 2017