Si10
Mi20
Mi30
 
Si10
Final Test handler
Si10 was designed for WLCSP post sawn test application in singulated die format. Die was picked from Sawn wafer for direct docking test and 5S-AOI follow by tape and reel process.
Maximum 12” wafer handling capability.
Reel input with De-taping module.
Direct docking test capability with multiple sites.
Full inspection for die back and front active area with minimum 6 cameras vision system.
Vision system with Side wall inspection.
Ideal tool for post sawn test application.
Enhance Post seal inspection.
Reject bad die to wafer pack.
Optional input/output : Jedec tray and Waffle pack.
[Please contact us for more information]